Module Technology

Fraunhofer Center for Silicon Photovoltaics CSP

© Fraunhofer CSP

Profile

The research activities focus on analysis, optimization and development of industrial manufacturing processes. The research areas include cell metallization, a variety of series interconnection technologies, conventional soldering technologies as well as innovative laser and conductive adhesive interconnection processes. Besides the optimization of classical lamination technologies new encapsulation approaches like injection moulding are under development. In cooperation with the group »Module Reliability« mechanical stresses and damaging processes during single manufacturing steps as well as estimated residual stresses after the complete module assembly are estimated. The result is a systematic approach of optimized processes and technologies.

Publications

  • Steudel, F.; Miclea, P.-T.; Teuscher, N.; Heilmann, A.; Schweizer, S.; Optical simulation of transparent conductive oxide (TCO) films on borate glasses; in Proc. of 27th European Photovoltaic Solar Energy Conference and Exhibition EU PVSEC 2012; Nowak, S.; Jäger-Waldau, A.; Helm, P. (Hrsg.); WIP München (2012) 467-470; 739/2012

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